Embedded Vision

Jetson AGX Xavier FPD-Link III Interface Card

For NVIDIA Jetson AGX Xavier Developer Kit

Sixteen (16) FPD-Link III input channels to Jetson kit

This interface card delivers maximum inputs for the NVIDIA Jetson AGX Xavier™ Developer Kit, combining up to 16 streams of input data via the FPD-Link III interface. Sensor data is delivered via a serial link and is deserialized into MIPI CSI-2 data for consumption on the AGX Xavier Developer Kit. This allows the sensors to be placed up to 15 meters away from the processing unit. GPIO and I2C control are available for configuration and reset. An on-board FPGA provides hardware-level synchronization capability. Supported camera modules and radar modules are available from D3 Engineering.

 Download the data sheet

 Contact D3 Engineering to purchase

Jetson SERDES Sensor Interface Card

For NVIDIA® Jetson TX1 or TX2 Evaluation Kit

Direct 4-lane MIPI CSI-2 input from sensors to Jetson kit

The D3 DesignCore® Jetson SERDES Sensor Interface card is an add-on for the NVIDIA®Jetson TX1 or TX2 Evaluation Kit.  It supports both Texas Instruments FPD-Link™ III and Maxim Integrated GMSL2 deserializers.  This card allows for multiple tethered sensors to be interfaced to the powerful NVIDIA Jetson embedded platform for autonomous applications, industrial applicaitons, and more.  The card also contains a direct MIPI CSI-2 connection to interface sensors directly to the Jetson Evaluation Kit.  Supported camera modules and radar modules are available from D3 Engineering.

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DragonBoard™ 410c Camera Kit

with D3 DesignCore® Camera Mezzanine Board OV5640

Qualcomm® Snapdragon™ 410E

Designed for rapid development of embedded vision applications, this kit includes a DragonBoard™ 410c by Arrow Electronics, based on the Qualcomm® Snapdragon™ 410E processor, with a D3 DesignCore® Camera Mezzanine Board, and a 5MP micro camera module. Direct MIPI CSI-2 access to camera data allows more realistic evaluation of embedded vision designs.

Download the Dragonboard 410c Camera Kit data sheet

D3 DesignCore® Camera Mezzanine Board OV5640

for the DragonBoard™ 410c

Part of the DragonBoard™ 410c Camera Kit, this mezzanine board is also available separately. It directly connects up to two MIPI CSI-2 cameras to the DragonBoard 410c. One miniature camera module is included. Expansion headers provide access to other communication interfaces on the Qualcomm® Snapdragon™ 410E including I2C, SPI, and UART.

Download the DesignCore® Camera Mezzanine Board OV5640 data sheet

Jetson RSP-TX2 Development Kit

Rugged Sensor Platform (RSP) with NVIDIA Jetson TX2 Processor

Connect multiple vision and spatial sensors to the Jetson TX2 for deployment in rugged systems

The D3 DesignCore® Jetson TX2 Rugged Sensor Platform (RSP) provides six high-speed SerDes inputs for a variety of vision and spatial sensors. It speeds development of your autonomous and deep learning applications. Wi-Fi®, Bluetooth®, Gigabit Ethernet and USB 3.0 interfaces are available for control and data offload. There are two independent HDMI displays. SSD and eSATA expansion is available for hours of raw data storage capability. The RSP’s ruggedized enclosure and connectors make it ideal for deployment in the field.

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RVP-AM57x Development Kit

3GHz FPD-Link™ III

Texas Instruments AM5718 | AM5728 | AM5729 Sitara ARM processor

8-Channel System with EVE and/or ISS coprocessors

This development kit enables synchronous acquisition of eight 1080p HD video streams with real-time vision processing and analytics. The SOM board features a Texas Instruments AM57x processor and firmware with an optimized layout and BOM for fast transition to manufacturing. The customizable baseboard contains IO, power, an expansion interface, and more. We can provide cameras, sensor integration, algorithm development, and customization. Use this development kit to rapidly develop your Engineering Verification Test (EVT) unit.

Download Data Sheet

 Email us for more information

 or call 585-429-1550 and ask to speak to a sales support specialist

Rugged Camera Modules

Ruggedized, fully-enclosed assemblies with automotive and industrial interfaces

Fully validated models available | FPD-Link™ III, BroadR-Reach®, Ethernet, GMSL2

These production-ready modules are designed for OEM/ODM use in harsh environments. The sealed, rugged enclosure includes a camera board with image sensor and 100% machine-aligned optics. Mounting interfaces are integrated into the packaging.

The D3RCM supports automotive and industrial platforms. All modules are designed to IP67, automotive, and industrial standards. Fully validated models are available.

VIEW D3RCM RUGGED CAMERA MODULES

AM57x SOM Reference Design

For compact, high performance vision systems

AM5728 or AM5729 Sitara ARM processor

This production-intent reference design is designed for manufacturing. It can be integrated into your product, or you can work with the D3 Engineering design services team to customize it for form, fit, and function.

 Email us for more information

 or call 585-429-1550 and ask to speak to a sales support specialist

Smart Camera Platform

Qualcomm^® Snapdragon™ 410

The Qualcomm® Snapdragon™ 410 processor has four ARM Cortex-A53 processors, an integrated 4G LTE modem, a DSP for processing audio, video, and mobile broadband signals, and a GPU for graphics and analytics processing. A hardware CODEC supports both H.264 (AVC) and H.265 (HEVC) video compression. D3’s Reference Design can support up to two camera inputs (MIPI CSI2). Applications include intelligent transportation, smart cities, smart homes, and high-end UAV payloads.

 Download our DesignCore® Snapdragon™ 410 Reference Design data sheet

 Contact us for more information

Smart Camera Platform

NVIDIA^® Tegra^® X1

The NVIDIA Tegra X1 mobile vision processor hosts four 64-bit ARM Cortex-A57 CPU cores and a 256-core GPU. A hardware CODEC supports H.264 and 4K H.265 compression at 60 fps. D3’s Reference Design is based on the NVIDIA® Jetson TX1 System on Module (SOM), and supports multiple MIPI camera inputs. Applications include analytics-intensive intelligent transportation, smart cities, smart homes, and high-end UAV payloads.

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IoT Camera Platform

GEO Semiconductor GC6500 ISP

This Reference Design supports any MIPI CSI2 sensor with H.264 encoded video streaming over WiFi. Real-time lens de-warping capability makes it particularly appropriate for wide-angle surveillance and monitoring applications. Applications include smart homes, building automation, and fixed surveillance.

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Machine Vision Camera Platform

GEO Semiconductor GC4x ISP

This extremely versatile platform supports a wide range of applications requiring raw or compressed video. Real-time lens de-warping capability makes it particularly appropriate for wide-angle surveillance and monitoring applications. Applications include inspection and QC, tethered surveillance cameras, and cameras for autonomous platforms including vehicles and robots.

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Machine Vision Camera Platform

Intel^® FPGA

Based on an Intel® (Altera) FPGA, this platform includes D3’s Image Signal Processor (ISP) core and MIPI I/O cores running in the FPGA fabric. The design is scalable from MAX10 to Cyclone to Arria FPGAs. Applications include high-speed, uncompressed video capture uses such as inspection and QC, tethered surveillance cameras, and cameras for autonomous platforms including vehicles and robots.

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Digital Camera Sensor Module

The Digital Camera Sensor Module is the foundation of all of our camera Reference Designs. The single-board module hosts a CMOS image sensor (OmniVision, On Semi, SONY), an integrated lens, and a flex-tail connector. Supported output formats include MIPI CSI2 and parallel digital (sensor-dependent).

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