Enhancing imaging with edge analytics and connectivity

D3 Engineering supports your product development team with our expertise in Embedded Vision. We understand image sensors, optics, video analytics, and imaging system design. Working with a wide range of image sensors and processors, we design and optimize the complete camera chain: image capture, image processing, encoding, display, optics, motion, and wired or wireless connectivity.

We help you add value to your products by giving your users more power to see and control their world. Let us help you get to market faster, while reducing the risks and costs of new product development.

Design Services

We offer a range of product development services. We can deliver full-cycle embedded system development: hardware and firmware design, application software development, validation, and transition to manufacturing. Or we can help your product development team with specific tasks such as processor selection, system architecture, sensor integration, and algorithm integration and optimization.

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Expertise in Vision

IMAGE SENSORS | We select the best combination of sensor size, frame rate, shutter type, and specialized features to meet your performance goals. We work with a wide range of image sensors and camera interfaces including MIPI CSI-2, HiSPi, LVDS, and SLVS.

VISION PROCESSORS |  We use our expertise in all of the accelerated cores within today’s rapidly expanding SoC architectures to give you maximum image processing performance. Our core skills include configuring and tuning the image signal processor, real-time image processing, and video encoding (i.e., H.265 and JPEG). We develop custom drivers and board support packages.

CONNECTIVITY | Our vision systems feature wired and wireless connectivity including USB 2.0 and 3.0, CoaXPress (CXP), Camera Link, FPD-Link III, GMSL, GigE, 802.11 WiFi, and Bluetooth.

OPTICS| We have ready access to high-performance COTS lens assemblies as well as custom lens system design from our base in Rochester, NY.

MOTION CONTROL | We optimize focus, shutter, and aperture control using our strengths in motor selection and characterization, design and optimization of the motion control loop, and development of real-time embedded firmware.

DesignCore® Platforms

Our proven Reference Designs and Development Kits feature vision processor technology from Texas Instruments, Qualcomm, NVIDIA, Intel FPGA (Altera), and others. Our real-time embedded software framework provides the basis for your custom application. Use our DesignCore® Platforms to guide your own development, or work with D3 to customize one for your system.

Starter Kits

Our Starter Kits are designed for rapid evaluation of technology on the lab bench. We can help your engineers quickly evaluate and adopt new technology.

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DragonBoard™ 410c Camera Kit
with D3 DesignCore® Camera Mezzanine Board OV5640
Qualcomm® Snapdragon™ 410E

Designed for rapid development of embedded vision applications, this kit includes a DragonBoard™ 410c by Arrow Electronics, based on the Qualcomm® Snapdragon™ 410E processor, with a D3 DesignCore® Camera Mezzanine Board, and a 5MP micro camera module. Direct MIPI CSI-2 access to camera data allows more realistic evaluation of embedded vision designs.

Download the Dragonboard 410c Camera Kit data sheet

Buy now at arrow.com

Product Lead Time:

Check Arrow.com for stock

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D3 DesignCore® Camera Mezzanine Board OV5640
for the DragonBoard™ 410c

Part of the DragonBoard™ 410c Camera Kit, this mezzanine board is also available separately. It directly connects up to two MIPI CSI-2 cameras to the DragonBoard 410c. One miniature camera module is included. Expansion headers provide access to other communication interfaces on the Qualcomm® Snapdragon™ 410E including I2C, SPI, and UART.

Download the DesignCore® Camera Mezzanine Board OV5640 data sheet

Buy now at arrow.com

Product Lead Time:

Check Arrow.com for stock

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Jetson SERDES Sensor Interface Card
For NVIDIA® Jetson TX1 or TX2 Evaluation Kit
Direct 4-lane MIPI CSI-2 input from sensors to Jetson kit

The D3 DesignCore® Jetson SERDES Sensor Interface card is an add-on for the NVIDIA®Jetson TX1 or TX2 Evaluation Kit.  It supports both Texas Instruments FPD-Link™ III and Maxim Integrated GMSL2 deserializers.  This card allows for multiple tethered sensors to be interfaced to the powerful NVIDIA Jetson embedded platform for autonomous applications, industrial applicaitons, and more.  The card also contains a direct MIPI CSI-2 connection to interface sensors directly to the Jetson Evaluation Kit.  Supported camera modules and radar modules are available from D3 Engineering.

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DesignCore® Development Kits

Development Kits are designed for fast prototyping in real-world situations. We can help your engineering team use our Development Kits to get your product to market faster.

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RSP-TX2 Development Kit
Rugged Sensor Platform (RSP) with NVIDIA Jetson TX2 Processor
Connect multiple vision and spatial sensors to the Jetson TX2 for deployment in rugged systems

The D3 DesignCore® Jetson TX2 Rugged Sensor Platform (RSP) provides six high-speed SerDes inputs for a variety of vision and spatial sensors. It speeds development of your autonomous and deep learning applications. Wi-Fi®, Bluetooth®, Gigabit Ethernet and USB 3.0 interfaces are available for control and data offload. There are two independent HDMI displays. SSD and eSATA expansion is available for hours of raw data storage capability. The RSP’s ruggedized enclosure and connectors make it ideal for deployment in the field.

Download Data Sheet

 Email us for more information

 or call 585-429-1550 and ask to speak to a sales support specialist

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RVP-AM57x Development Kit
3GHz FPD-Link™ III
AM5718 | AM5728 | AM5729 Sitara ARM processor

8-Channel System with EVE and/or ISS coprocessors

This development kit enables synchronous acquisition of eight 1080p HD video streams with real-time vision processing and analytics. The SOM board features a Texas Instruments AM57x processor and firmware with an optimized layout and BOM for fast transition to manufacturing. The customizable baseboard contains IO, power, an expansion interface, and more. We can provide cameras, sensor integration, algorithm development, and customization. Use this development kit to rapidly develop your Engineering Verification Test (EVT) unit.

Download Data Sheet

 Email us for more information

 or call 585-429-1550 and ask to speak to a sales support specialist

ODM Products

Ready for direct integration into your system. Contact ODM@D3Engineering.com to learn more.

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Rugged Camera Modules
Ruggedized, fully-enclosed assemblies with automotive and industrial interfaces
Fully validated models available | FPD-Link™ III, BroadR-Reach®, Ethernet, GMSL2

These production-ready modules are designed for OEM/ODM use in harsh environments. The sealed, rugged enclosure includes a camera board with image sensor and 100% machine-aligned optics. Mounting interfaces are integrated into the packaging.

The D3RCM supports automotive and industrial platforms. All modules are designed to IP67, automotive, and industrial standards. Fully validated models are available.

VIEW D3RCM RUGGED CAMERA MODULES

DesignCore® Reference Designs

D3 Integrated Camera Platforms leverage our digital camera sensor module Reference Designs—adding interface connectivity and an internal processor for video analytics and compression. Supported interfaces include USB, GigE, Camera Link, CoaXPress (CXP), and FPD-Link™ III.

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AM57x SOM Reference Design
For compact, high performance vision systems
AM5728 or AM5729 Sitara ARM processor

This production-intent reference design is designed for manufacturing. It can be integrated into your product, or you can work with the D3 Engineering design services team to customize it for form, fit, and function.

 Email us for more information

 or call 585-429-1550 and ask to speak to a sales support specialist

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Smart Camera Platform
Qualcomm® Snapdragon™ 410

The Qualcomm® Snapdragon™ 410 processor has four ARM Cortex-A53 processors, an integrated 4G LTE modem, a DSP for processing audio, video, and mobile broadband signals, and a GPU for graphics and analytics processing. A hardware CODEC supports both H.264 (AVC) and H.265 (HEVC) video compression. D3’s Reference Design can support up to two camera inputs (MIPI CSI2). Applications include intelligent transportation, smart cities, smart homes, and high-end UAV payloads.

 Download our DesignCore® Snapdragon™ 410 Reference Design data sheet

 Contact us for more information

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Smart Camera Platform
NVIDIA® Tegra® X1

The NVIDIA Tegra X1 mobile vision processor hosts four 64-bit ARM Cortex-A57 CPU cores and a 256-core GPU. A hardware CODEC supports H.264 and 4K H.265 compression at 60 fps. D3’s Reference Design is based on the NVIDIA® Jetson TX1 System on Module (SOM), and supports multiple MIPI camera inputs. Applications include analytics-intensive intelligent transportation, smart cities, smart homes, and high-end UAV payloads.

Contact us for more information

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IoT Camera Platform
GEO Semiconductor GC6500 ISP

This Reference Design supports any MIPI CSI2 sensor with H.264 encoded video streaming over WiFi. Real-time lens de-warping capability makes it particularly appropriate for wide-angle surveillance and monitoring applications. Applications include smart homes, building automation, and fixed surveillance.

 Contact us for more information

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Machine Vision Camera Platform
GEO Semiconductor GC4x ISP

This extremely versatile platform supports a wide range of applications requiring raw or compressed video. Real-time lens de-warping capability makes it particularly appropriate for wide-angle surveillance and monitoring applications. Applications include inspection and QC, tethered surveillance cameras, and cameras for autonomous platforms including vehicles and robots.

 Contact us for more information

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Machine Vision Camera Platform
Intel® FPGA

Based on an Intel® (Altera) FPGA, this platform includes D3’s Image Signal Processor (ISP) core and MIPI I/O cores running in the FPGA fabric. The design is scalable from MAX10 to Cyclone to Arria FPGAs. Applications include high-speed, uncompressed video capture uses such as inspection and QC, tethered surveillance cameras, and cameras for autonomous platforms including vehicles and robots.

 Contact us for more information

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Digital Camera Sensor Module

The Digital Camera Sensor Module is the foundation of all of our camera Reference Designs. The single-board module hosts a CMOS image sensor (OmniVision, On Semi, SONY), an integrated lens, and a flex-tail connector. Supported output formats include MIPI CSI2 and parallel digital (sensor-dependent).

 Contact us for more information

Applications

  • Smart Cities/Smart Homes
  • Building Automation
  • Public Safety
  • Surveillance Cameras
  • Factory Automation
  • Machine Vision and Inspection/QC
  • Retail and POS
  • Intelligent Transportation Systems (ITS)

D3 Advantage

  • Protect your intellectual property
  • Reduce the risk of new product development
  • Get to market faster with Embedded Vision

Let's Get Started

D3 Engineering has the specialized Embedded Vision design skills, proven technologies, and reliable development process you need. Let us help you pave the fastest, lowest-risk path to market. Contact sales@D3Engineering.com today.