Embedded vision systems development on NVIDIA® Jetson™ platforms with AGX Xavier™, Xavier™ NX, TX2, and Nano modules

Get to market faster, with less risk

D3 Engineering develops embedded vision systems using the NVIDIA Jetson platform, taking full advantage of Jetson’s high-performance, low-power computing capabilities for processing complex data at the edge.

We can help your product development team get to market faster. Our camera design capability, SOM reference designs, development kits, and CUDA programming expertise all serve to accelerate your product development.

D3 is supporting ROS2 ready drivers for our D3CM-IMX390 camera on our NVIDIA Jetson products! Click here to purchase the D3CM-IMX390.

NVIDIA Jetson camera design and integration capabilities

  • Rolling and Global Shutters
  • Optics Design and Integration
  • FPGA Expertise to Bridge LVDS, SLVS, etc. to MIPI CSI-2
  • Custom Baseboard Design

Jetpack (Jetson SDK) Expertise

  • Embedded Linux Development
  • Camera Drivers and Integration
  • ISP Tuning
  • Video Chain Implementation and Optimization
  • Multi-Core SOC Application Development
  • CUDA® Programming
  • Power and Performance Optimization

Edge AI expertise

With decades of experience, we understand how to get the most from vision processors, image sensors, and optics. We excel at video analytics, imaging system design, real-time image processing, and wired or wireless connectivity.

Embedded systems design services

We offer deliver full-cycle embedded systems development for customers who need an application-specific baseboard to achieve their goals, such as lowest product cost or ability to fit a specific form factor. Or we can help your product development team with specific tasks such as system architecture, sensor integration, and algorithm integration and optimization.

DesignCore® Platforms

Jetson Xavier NX 12-Camera Carrier Board

Supports the NVIDIA Jetson Xavier NX Module*
Twelve (12) FPD-Link III input channels

This carrier board allows users to quickly interface and develop with the Jetson Xavier™ NX Module or Jetson Xavier™ TX2 NX Module by combining up to 12 streams of input data via the FPD-Link III interface. Sensor data is delivered via a serial link and is deserialized into MIPI CSI-2 data for consumption on the module. This allows the sensors to be placed up to 15 meters away from the processing unit. An on-board FPGA provides hardware-level synchronization capability. Supported camera modules, 3D ToF, and mmWave radar modules are available from D3 Engineering.

*The board is compatible with the TX2 NX or Nano modules, but software may not be supported yet.

Download the Datasheet


Jetson AGX Xavier FPD-Link III Interface Card

Jetson AGX Xavier FPD-Link III Interface Card

For NVIDIA Jetson AGX Xavier Developer Kit
Sixteen (16) FPD-Link III input channels

This interface card delivers maximum inputs for the NVIDIA Jetson AGX Xavier™ Developer Kit, combining up to 16 streams of input data via the FPD-Link III interface. Sensor data is delivered via a serial link and is deserialized into MIPI CSI-2 data for consumption on the Jetson AGX Xavier Developer Kit. This allows the sensors to be placed up to 15 meters away from the processing unit. GPIO and I2C control are available for configuration and reset. An on-board FPGA provides hardware-level synchronization capability. Supported camera modules, 3D ToF, and mmWave radar modules are available from D3 Engineering.

Download the Datasheet


Jetson SerDes Sensor Interface Card

Jetson SerDes Sensor Interface Card

For NVIDIA Jetson TX2 and AGX Xavier Developer Kits
4x FPD-Link III and 2x GMSL2 input channels

The DesignCore® Jetson SerDes Sensor Interface card is an add-on for the NVIDIA Jetson TX2 Developer Kit and NVIDIA Jetson AGX Xavier™ Developer Kit. The card supports both Texas Instruments FPD-Link™ III and Maxim Integrated GMSL2 deserializers.  It allows for multiple tethered sensors to be interfaced to the powerful NVIDIA Jetson embedded platform for autonomous applications, industrial applications, and more.  The card also contains a direct MIPI CSI-2 connection to interface sensors directly to the Jetson Developer Kit.  Supported camera modules, 3D ToF, and mmWave radar modules are available from D3 Engineering.

Download the Datasheet


Jetson RSP-TX2 Development Kit

Jetson RSP-TX2 Development Kit

Rugged Sensor Platform (RSP) with NVIDIA Jetson TX2 Processor
Connect multiple vision and spatial sensors to the Jetson TX2 for deployment in rugged systems

The D3 DesignCore® Jetson TX2 Rugged Sensor Platform (RSP) provides six high-speed SerDes inputs for a variety of vision and spatial sensors. It speeds development of your autonomous and deep learning applications. Wi-Fi®, Bluetooth®, Gigabit Ethernet and USB 3.0 interfaces are available for control and data offload. There are two independent HDMI displays. SSD and eSATA expansion is available for hours of raw data storage capability. The RSP’s ruggedized enclosure and connectors make it ideal for deployment in the field.

Download the Datasheet

DesignCore® Camera Modules

D3RCM-IMX390-953 Rugged Camera Module

D3RCM-IMX390-953 Rugged Camera Module

IP69K Rated with Sony IMX390 Sensor and FPD-Link III Interface
HDR Capable

This 2.1 MP FPD-Link™ III camera is a rugged camera module with SONY® IMX390 image sensor and FPD-Link™ III DS90UB953A serializer. It is designed for automotive and performance-critical industrial applications. It has superior thermal characteristics and was designed to withstand harsh environmental conditions. Use in evaluation or production systems.

Download the Datasheet


D3CM-IMX390 Camera Module

D3CM-IMX390 Camera Module

Development Module with Sony IMX390 Sensor and FPD-Link III Interface e
HDR Capable

This FPD-Link™ III camera features the SONY® IMX390 image sensor and 4 GHz FPD-Link™ III  DS90UB953 serializer. The D3CM-IMX390 is unsealed and may be customized with alternative lenses. Use in evaluation and demo systems. Ask about our sealed D3CM camera options.

Download the Datasheet


D3 Rugged FPD-Link camera module OV10640 camera module validated for automotive

D3RCM-OV10640-953 Rugged Camera Module

IP69K Rated with OmniVision OV10640 Sensor and FPD-Link III Interface
HDR Capable

This 1.3 MP FPD-Link™ III camera is a fully-validated, rugged camera module featuring the OmniVision® OV10640 image sensor. It is validated for thermal, electrical, and mechanical performance and is ready for production in automotive and performance-critical industrial applications. Use in evaluation or production systems.

Download the Datasheet


D3CM-IMX390 Camera Module

Additional D3 Camera Modules

For Use With Evaluation Kits or in Production

The D3CM camera product line is continuing to expand.

Ask about our new sensor options:

  • Sony IMX490
  • Onsemi AR0234 (Global Shutter)
  • Onsemi AR0820/821
  • OmniVision OV2311 (Global Shutter, monochrome)

GMSL2 interface and a sealed option for D3CM cameras also coming soon!


Additional Sensor Modules, Rugged Camera Modules, and Camera Modules

Customized Sensor Modules and Camera Modules

For Use With Evaluation Kits or in Production

D3 Engineering’s ODM camera product family features rugged camera modules that are ready for production, as well as board-level cameras and enclosed camera assemblies that we can customize to your requirements.

Work with our design services team to use our DesignCore® Development Platforms or other platforms for rapid technology evaluation, prototypes, and system development. Then rely on us to provide ODM camera modules in the volumes you need for your production systems.