High-quality camera modules for performance-critical embedded vision
D3 Engineering’s ODM camera product family features rugged camera modules that are ready for production, as well as board-level cameras and enclosed camera assemblies that we can customize to your requirements.
We integrate high-performance image sensors and optics using the latest manufacturing technologies, ensuring consistent performance across operating conditions. This includes robotic active alignment of optics and 100% unit inspection. Whether volumes are 10 or 10 million, D3 is prepared to support your product with advanced manufacturing in the USA or offshore, using the same validated processes and equipment.
INDUSTRIAL | Materials Handling, Robotics, Machine Vision
TRANSPORTATION | Automotive, Trucking, Industrial Vehicles
MEDICAL AND SCIENTIFIC IMAGING | Medical Devices, Instrumentation, Endoscopes, Lab Equipment
DEFENSE | Surveillance, UAVs, Drones
COMMERCIAL | IoT, Security and Surveillance, Retail and Point-of-Sale, Building Automation
D3 ODM Camera Family
These products are compatible with DesignCore® Development Kits and Starter Kits.
Work with our design services team to use these kits and other platforms for rapid technology evaluation, prototypes, and system development. Options include ISP, software drivers, autofocus, and environmental specifications including commercial, industrial, and automotive temperature.
Then rely on us to provide ODM camera modules in the volumes you need for your production systems.
D3 Camera Module Features
- Quality-controlled assembly with 100% unit inspection to specification
- High-performance image sensors from major manufacturers
- Wide range of COTS and custom lenses
- Camera software support
- Designed for performance-critical products with long-lifetime availability and support
D3 Engineering Design Services
- Integration with DesignCore™ embedded vision platforms for rapid evaluation and system development
- Customization and integration with your embedded vision platform or ours
D3 Sensor Modules – D3SM
Board-level assembly with direct sensor interface
MIPI CSI-2, LVDS, parallel video
These production-optimized modules are designed for integration into embedded systems. The unenclosed image sensor board has an image sensor with direct digital sensor output, a board-level connector, and a lens mount with an actively-aligned lens.
The D3SM supports popular development board interfaces including the D3 DesignCore™ Camera Mezzanine Board, the Arrow DragonBoard™ Camera Kit, and the BeagleBoard.
D3 Camera Modules – D3CM
Enclosed assembly supporting standard camera interfaces
USB 3.0, GigE, CoaXPress®, FPD-Link™ III, BroadR-Reach®, GMSL2
These camera assemblies are designed to support rapid evaluation of image sensor, optics, and interface combinations. They deliver higher performance and more flexibility than COTS camera modules. The packaged camera solution includes actively aligned optics, image sensor, and camera data interface. The unsealed enclosure can be passively cooled or fan cooled.
The D3CM supports standard camera interfaces on embedded platforms, frame grabber, standard PC, or x86 hardware.
D3 Rugged Camera Modules – D3RCM
Ruggedized, fully-enclosed assemblies have sealed connectors and automotive or industrial interfaces
FPD-Link™ III, BroadR-Reach®, Ethernet, GMSL2
These production-ready modules are designed for ODM use in harsh environments. The sealed, rugged enclosure includes a camera board with image sensor and 100% machine-aligned optics. Mounting interfaces are integrated into the packaging.
The D3RCM supports automotive and industrial platforms. All modules are designed to IP67, automotive, and industrial standards. Fully validated models are available.