This FPD-Link™ III camera is ideal for vision system evaluation and demo platforms. It is designed for use with D3 Engineering’s DesignCore® RVP (Rugged Vision Platform) Development Kits. The D3CM features the Sony® IMX390 sensor and optics in an unsealed (non-rugged) enclosure. It has industrial environmental ratings.
192 deg FOV, 56 deg FOV
Evaluation or production systems.
Available starting at quantity of 25. Contact D3.
DesignCore RVP-TDA3x Development Kit with 4Ghz FPD-Link SerDes
Additional Product Information
Read the DesignCore™ D3CM-IMX390 Camera Module Data Sheet for additional information and product specifications.
SKU (192 FOV): 1001020-20
SKU (56 FOV): 1001020-23
- FPD-Link™ III Camera
- Sony® IMX390 Image Sensor
- Resolution: 1080p HD (1920X1080)
- Frame Rate: 60fps
- MIPI-CSI2 Over FPD-Link III (Serial) Video Output
- Back-Channel Configuration Connectivity
- Square Pixel and RGGB Filter Array
- Motion Artifact-Free HDR
- On-Board Image Compression
- Built-in LED Flicker Mitigation
- Supports leading vision and sensor processors
- NVIDIA Jetson TX1/TX2 and AGX Xavier
- Texas Instruments TDA3x and TDA2P
Automotive Advanced Driver Assist (ADAS) Systems
- Front or rear camera
- 3D Surround View
- Driver monitoring
- Camera monitoring systems (CMS)
Autonomous Trucking/Transportation Systems
Autonomous Guided Vehicles (AGV)
360-Degree Vision Systems
DesignCore®NVIDIA® Jetson SerDes Sensor Interface Card
DesignCore®NVIDIA® Jetson AGX Xavier FPD-Link III Interface Card
Get to market fast with D3 Engineering Product Development Services
We can support integration of D3 Camera Modules into your end product with services including custom ISP tuning, software drivers, and verification support. We can also help you speed embedded vision system development with our proven DesignCore® vision processor platforms and full-cycle embedded product development services. Our expertise in imaging system design will help you get to market faster, while reducing the risks and costs of new product development.