D3 camera mezzanine board enables direct MIPI CSI-2 access to Snapdragon® processor for rapid development of high-performance embedded vision applications
D3 Engineering’s Jerome Barczykowski will present “System engineering considerations in rugged/automotive camera module design” at Image Sensors Auto Americas, October 10–11 in San Francisco, CA.
96Boards OpenHours featured D3 Engineering’s DesignCore Camera Mezzanine board for the DragonBoard 410c. The session included demos from D3 in Rochester, NY and the Qualcomm Thinkabit lab in San Diego. View the recorded session and chat log on 96boards.org.
A new article on Power Systems Design describes the new motor control hardware platform designed by Intel and D3 Engineering. This tandem motion-power motor control board features a single Max® 10 FPGA to control a bidirectional DC-DC converter as well as two motors.
Direct MIPI CSI-2 access to camera data enables more realistic evaluation of lower power, higher performance embedded vision systems and proof-of-concept prototypes.
D3 Engineering’s 8-channel SerDes Rugged Vision Platform features Texas Instruments TDA2x vision processor and 3GHz FPD-Link III SerDes interface
D3 Engineering announces availability of DesignCore(tm) ADAS Development Kit, featuring reference design with Texas Instruments TDA3x automotive vision processor.
Texas Instruments and D3 demonstrate test-vehicle-ready kit at TU-Automotive 2016