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Jetson AGX Xavier FPD-Link III Interface Card

DesignCore® Interface Card Has 16 Camera/Sensor Channels to Speed AI System Development with NVIDIA Jetson AGX Xavier Developer Kit

March 14, 2019

Features High-Speed SerDes Input via Texas Instruments FPD-Link™ III Interface, Power-Over-Coax, and On-Board FPGA for Hardware-Level Synchronization

Jetson RSP-TX2 Development Kit

Field-deployable Development Kit features NVIDIA Jetson™ TX2 processor, six high-speed sensor inputs

February 14, 2019

DesignCore® NVIDIA Jetson™ RSP-TX2 (Rugged Sensor Platform) development kit from D3 Engineering enables rapid system development for autonomous and deep learning applications

RVP-TDA2Px

New TDA2Px / DRA77xP Dev Kit speeds ADAS, autonomous system design through production

October 29, 2018

D3 Engineering DesignCore® Rugged Vision Platform (RVP) supports on-vehicle technology evaluation, rapid development of A-samples, and a streamlined path to production

D3 to show rugged TX2 Development Kit at NVIDIA GPU Technology Conference

October 18, 2018

DesignCore® RSP-TX2 Rugged Sensor Platform connects multiple vision and spatial sensors to the NVIDIA Jetson TX2 for deployment in rugged systems.

D3RCM-IMX390-953 Rugged Camera Module

Miniature rugged FPD-Link™ III camera module available now for transportation, industrial vision systems

October 11, 2018

Small and lightweight, the 1.3MP sealed camera module is designed to IP69K and fully validated for production

Jetson SerDes Sensor Interface Card

DesignCore® Jetson SerDes Sensor Interface Card supports NVIDIA Jetson TX1/TX2 and Xavier™ Developer Kits

September 20, 2018

Engineers can easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development

D3 Becomes NVIDIA Jetson Preferred Partner for Camera Development

August 20, 2018

Access to Jetson camera toolchain enhances D3 Engineering’s embedded vision system development capabilities for high-performance, cost-optimized custom camera systems

D3RCM

D3 announces rugged FPD-Link™ III camera modules for automotive and industrial vision

August 1, 2018

Small, lightweight, sealed camera modules are designed to IP69K

D3-Fotonation-DMS_Kit-sm

DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design

May 14, 2018

Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.

Development platforms pave the way to production systems for ADAS

January 23, 2018

Developing a production advanced driver assistance system (ADAS) requires working in both controlled laboratory environments and real-world scenarios. Development platforms from TI’s ecosystem design partners can help.

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