D3 Engineering to show rugged TX2 Development Kit at NVIDIA GPU Technology Conference
DesignCore® RSP-TX2 Rugged Sensor Platform connects multiple vision and spatial sensors to the NVIDIA Jetson TX2 for deployment in rugged systems.
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Miniature rugged FPD-Link™ III camera module available now for transportation, industrial vision systems
Small and lightweight, the 1.3MP sealed camera module is designed to IP69K and fully validated for production
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DesignCore® Jetson SerDes Sensor Interface Card supports NVIDIA Jetson TX1/TX2 and Xavier™ Developer Kits
Engineers can easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development
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D3 Becomes NVIDIA Jetson Preferred Partner for Camera Development
Access to Jetson camera toolchain enhances D3 Engineering’s embedded vision system development capabilities for high-performance, cost-optimized custom camera systems
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D3 Engineering announces rugged FPD-Link™ III camera modules for automotive and industrial vision
Small, lightweight, sealed camera modules are designed to IP69K
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DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design
Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.
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Development platforms pave the way to production systems for ADAS
Developing a production advanced driver assistance system (ADAS) requires working in both controlled laboratory environments and real-world scenarios. Development platforms from TI’s ecosystem design partners can help.
Read MoreDragonBoard™ 410c Camera Kit available now on Arrow.com
D3 camera mezzanine board enables direct MIPI CSI-2 access to Snapdragon® processor for rapid development of high-performance embedded vision applications
Read MoreD3 to Speak at Image Sensors Auto Americas 2017
D3 Engineering’s Jerome Barczykowski will present “System engineering considerations in rugged/automotive camera module design” at Image Sensors Auto Americas, October 10–11 in San Francisco, CA.
Read MoreD3 camera board featured on 96Boards OpenHours
96Boards OpenHours featured D3 Engineering’s DesignCore Camera Mezzanine board for the DragonBoard 410c. The session included demos from D3 in Rochester, NY and the Qualcomm Thinkabit lab in San Diego. View the recorded session and chat log on 96boards.org.
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