D3 Engineering Announces a DesignCore® Development Kit Designed Around the TDA4VM SoC Processor from Texas Instruments
A Ruggedized Platform for TI’s TDA4Vx SoC to evaluate and develop applications for use in ADAS technologies utilizing sensor fusion, deep learning, and analytics.
DesignCore® Interface Card Has 16 Camera/Sensor Channels to Speed AI System Development with NVIDIA Jetson AGX Xavier Developer Kit
Features High-Speed SerDes Input via Texas Instruments FPD-Link™ III Interface, Power-Over-Coax, and On-Board FPGA for Hardware-Level Synchronization
Field-deployable Development Kit features NVIDIA Jetson™ TX2 processor, six high-speed sensor inputs
DesignCore® NVIDIA Jetson™ RSP-TX2 (Rugged Sensor Platform) development kit from D3 Engineering enables rapid system development for autonomous and deep learning applications
New TDA2Px / DRA77xP Dev Kit speeds ADAS, autonomous system design through production
D3 Engineering DesignCore® Rugged Vision Platform (RVP) supports on-vehicle technology evaluation, rapid development of A-samples, and a streamlined path to production
D3 Engineering to show rugged TX2 Development Kit at NVIDIA GPU Technology Conference
DesignCore® RSP-TX2 Rugged Sensor Platform connects multiple vision and spatial sensors to the NVIDIA Jetson TX2 for deployment in rugged systems.
Miniature rugged FPD-Link™ III camera module available now for transportation, industrial vision systems
Small and lightweight, the 1.3MP sealed camera module is designed to IP69K and fully validated for production
DesignCore® Jetson SerDes Sensor Interface Card supports NVIDIA Jetson TX1/TX2 and Xavier™ Developer Kits
Engineers can easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development
D3 Becomes NVIDIA Jetson Preferred Partner for Camera Development
Access to Jetson camera toolchain enhances D3 Engineering’s embedded vision system development capabilities for high-performance, cost-optimized custom camera systems
D3 Engineering announces rugged FPD-Link™ III camera modules for automotive and industrial vision
Small, lightweight, sealed camera modules are designed to IP69K
DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design
Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.