New TDA2Px / DRA77xP Dev Kit speeds ADAS, autonomous system design through production
D3 Engineering DesignCore® Rugged Vision Platform (RVP) supports on-vehicle technology evaluation, rapid development of A-samples, and a streamlined path to production
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D3 Engineering to show rugged TX2 Development Kit at NVIDIA GPU Technology Conference
DesignCore® RSP-TX2 Rugged Sensor Platform connects multiple vision and spatial sensors to the NVIDIA Jetson TX2 for deployment in rugged systems.
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Miniature rugged FPD-Link™ III camera module available now for transportation, industrial vision systems
Small and lightweight, the 1.3MP sealed camera module is designed to IP69K and fully validated for production
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DesignCore® Jetson SerDes Sensor Interface Card supports NVIDIA Jetson TX1/TX2 and Xavier™ Developer Kits
Engineers can easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development
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D3 Becomes NVIDIA Jetson Preferred Partner for Camera Development
Access to Jetson camera toolchain enhances D3 Engineering’s embedded vision system development capabilities for high-performance, cost-optimized custom camera systems
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D3 Engineering announces rugged FPD-Link™ III camera modules for automotive and industrial vision
Small, lightweight, sealed camera modules are designed to IP69K
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DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design
Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.
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Development platforms pave the way to production systems for ADAS
Developing a production advanced driver assistance system (ADAS) requires working in both controlled laboratory environments and real-world scenarios. Development platforms from TI’s ecosystem design partners can help.
Read MoreDragonBoard™ 410c Camera Kit available now on Arrow.com
D3 camera mezzanine board enables direct MIPI CSI-2 access to Snapdragon® processor for rapid development of high-performance embedded vision applications
Read MoreD3 to Speak at Image Sensors Auto Americas 2017
D3 Engineering’s Jerome Barczykowski will present “System engineering considerations in rugged/automotive camera module design” at Image Sensors Auto Americas, October 10–11 in San Francisco, CA.
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