Embedded vision systems development on the NVIDIA® Jetson™ platform with Tegra X1/X2 and AGX Xavier™ processors

Jetson Tx2 Module WebGet to market faster, with less risk

D3 Engineering develops embedded vision systems using NVIDIA’s Jetson platform, taking full advantage of Jetson’s high-performance, low-power computing capabilities for processing complex data at the edge.

We can help your product development team get to market faster. Our camera design capability, SOM reference designs, development kits, and CUDA programming expertise all serve to accelerate your product development.

NVIDIA Jetson camera design and integration capabilities

Rolling and Global Shutters

Optics Design and Integration

FPGA Expertise to Bridge LVDS, SLVS, etc. to MIPI CSI-2

Custom Baseboard Design

Supported Sensors

Standard Custom  Upcoming


See available camera modules

SONY IMX271 (24MP)

SONY IMX172 (12MP)

On-Semi PYTHON 25K

On-Semi  AR0233

OmniVision OV10640


more to come

Jetpack (Jetson SDK) Expertise

Embedded Linux Development

Camera Drivers and Integration

ISP Tuning

Video Chain Implementation and Optimization

Multi-Core SOC Application Development

CUDA Programming

Power and Performance Optimization

Vision systems design expertise

With decades of experience, we understand how to get the most from vision processors, image sensors, and optics. We excel at video analytics, imaging system design, real-time image processing, and wired or wireless connectivity.

Embedded systems design services

We offer deliver full-cycle embedded systems development for customers who need an application-specific baseboard to achieve their goals, such as lowest product cost or ability to fit a specific form factor. Or we can help your product development team with specific tasks such as system architecture, sensor integration, and algorithm integration and optimization. Learn more about our Design Services:

DesignCore® Development Platforms

Jetson SerDes Sensor Interface Card
For NVIDIA Jetson TX2 and AGX Xavier Developer Kits
Direct 4-lane MIPI CSI-2 input from sensors to Jetson kit

The D3 DesignCore® Jetson SerDesSensor Interface card is an add-on for the NVIDIA Jetson TX2 Developer Kit and NVIDIA Jetson AGX Xavier™ Developer Kit. The card supports both Texas Instruments FPD-Link™ III and Maxim Integrated GMSL2 deserializers.  It allows for multiple tethered sensors to be interfaced to the powerful NVIDIA Jetson embedded platform for autonomous applications, industrial applications, and more.  The card also contains a direct MIPI CSI-2 connection to interface sensors directly to the Jetson Developer Kit.  Supported camera modules and radar modules are available from D3 Engineering.


RSP-TX2 Development Kit
Rugged Sensor Platform (RSP) with NVIDIA Jetson TX2 Processor
Connect multiple vision and spatial sensors to the Jetson TX2 for deployment in rugged systems

The D3 DesignCore® Jetson TX2 Rugged Sensor Platform (RSP) provides six high-speed SerDes inputs for a variety of vision and spatial sensors. It speeds development of your autonomous and deep learning applications. Wi-Fi®, Bluetooth®, Gigabit Ethernet and USB 3.0 interfaces are available for control and data offload. There are two independent HDMI displays. SSD and eSATA expansion is available for hours of raw data storage capability. The RSP’s ruggedized enclosure and connectors make it ideal for deployment in the field.
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 or call 585-429-1550 and ask to speak to a sales support specialist


DesignCore® Camera Modules

D3RCM-IMX390-953 Rugged Camera Module

D3RCM-IMX390-953 Rugged Camera Module
For Use With Jetson SerDes Sensor Interface Card
Sony IMX390 Sensor

This 2.1 MP FPD-Link™ III camera is a rugged camera module with SONY® IMX390 image sensor and FPD-Link™ III DS90UB953A serializer. It is designed for automotive and performance-critical industrial applications. It has superior thermal characteristics and was designed to withstand harsh environmental conditions. Use in evaluation or production systems.


D3CM-IMX390 Camera Module

D3CM-IMX390 Camera Module
For Use With Jetson SerDes Sensor Interface Card
Sony IM390 Sensor

This FPD-Link™ II camera features the SONY® IMX390 image sensor and 4 GHz FPD-Link™ III  DS90UB953 serializer. The unsealed (non-rugged) enclosure has industrial environmental ratings. Use in evaluation and demo systems.


Additional Sensor Modules, Rugged Camera Modules, and Camera Modules

Additional Sensor Modules, Rugged Camera Modules, and Camera Modules
For Use With Evaluation Kits or in Production
Validated models available

D3 Engineering’s ODM camera product family features rugged camera modules that are ready for production, as well as board-level cameras and enclosed camera assemblies that we can customize to your requirements.

Work with our design services team to use our DesignCore™ Development Platforms or other platforms for rapid technology evaluation, prototypes, and system development. Then rely on us to provide ODM camera modules in the volumes you need for your production systems.

Learn more about our ODM Camera Modules