D3 Engineering announces rugged FPD-Link™ III camera modules for automotive and industrial vision

August 1, 2018

Small, lightweight, sealed camera modules are designed to IP69K

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DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design

May 14, 2018

Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.

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Development platforms pave the way to production systems for ADAS

January 23, 2018

Developing a production advanced driver assistance system (ADAS) requires working in both controlled laboratory environments and real-world scenarios. Development platforms from TI’s ecosystem design partners can help.

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DragonBoard™ 410c Camera Kit available now on Arrow.com

November 14, 2017

D3 camera mezzanine board enables direct MIPI CSI-2 access to Snapdragon® processor for rapid development of high-performance embedded vision applications

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D3 to Speak at Image Sensors Auto Americas 2017

September 18, 2017

D3 Engineering’s Jerome Barczykowski will present “System engineering considerations in rugged/automotive camera module design” at Image Sensors Auto Americas, October 10–11 in San Francisco, CA.

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D3 camera board featured on 96Boards OpenHours

June 27, 2017

96Boards OpenHours featured D3 Engineering’s DesignCore Camera Mezzanine board for the DragonBoard 410c. The session included demos from D3 in Rochester, NY and the Qualcomm Thinkabit lab in San Diego. View the recorded session and chat log on 96boards.org.

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Tandem motion-power 48 V motor control board by Intel and D3

May 2, 2017

A new article on Power Systems Design describes the new motor control hardware platform designed by Intel and D3 Engineering. This tandem motion-power motor control board features a single Max® 10 FPGA to control a bidirectional DC-DC converter as well as two motors.

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DesignCore™ Camera Mezzanine Board for DragonBoard 410c speeds embedded vision development

April 20, 2017

Direct MIPI CSI-2 access to camera data enables more realistic evaluation of lower power, higher performance embedded vision systems and proof-of-concept prototypes.

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DesignCore™ RVP-TDA2x Development Kit supports high-end ADAS technology evaluation under realistic on-vehicle conditions

April 11, 2017

D3 Engineering’s 8-channel SerDes Rugged Vision Platform features Texas Instruments TDA2x vision processor and 3GHz FPD-Link III SerDes interface

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Dev Kit with TI TDA3x automotive vision processor lets OEMs try ADAS technology under realistic on-vehicle conditions

July 5, 2016

D3 Engineering announces availability of DesignCore(tm) ADAS Development Kit, featuring reference design with Texas Instruments TDA3x automotive vision processor.

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