D3 Engineering Announces a DesignCore® Development Kit Designed Around the TDA4VM SoC Processor from Texas Instruments
January 8, 2020
A Ruggedized Platform for TI’s TDA4Vx SoC to evaluate and develop applications for use in ADAS technologies utilizing sensor fusion, deep learning, and analytics.
Field-deployable Development Kit features NVIDIA Jetson™ TX2 processor, six high-speed sensor inputs
February 14, 2019
DesignCore® NVIDIA Jetson™ RSP-TX2 (Rugged Sensor Platform) development kit from D3 Engineering enables rapid system development for autonomous and deep learning applications
New TDA2Px / DRA77xP Dev Kit speeds ADAS, autonomous system design through production
October 29, 2018
D3 Engineering DesignCore® Rugged Vision Platform (RVP) supports on-vehicle technology evaluation, rapid development of A-samples, and a streamlined path to production
Engineers can easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development
D3 Becomes NVIDIA Jetson Preferred Partner for Camera Development
August 20, 2018
Access to Jetson camera toolchain enhances D3 Engineering’s embedded vision system development capabilities for high-performance, cost-optimized custom camera systems
DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design
May 14, 2018
Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.