News Archive - D3 Engineering

New TDA2Px / DRA77xP Dev Kit speeds ADAS, autonomous system design through production

October 29, 2018

D3 Engineering DesignCore® Rugged Vision Platform (RVP) supports on-vehicle technology evaluation, rapid development of A-samples, and a streamlined path to production

D3 Engineering to show rugged TX2 Development Kit at NVIDIA GPU Technology Conference

October 18, 2018

DesignCore® RSP-TX2 Rugged Sensor Platform connects multiple vision and spatial sensors to the NVIDIA Jetson TX2 for deployment in rugged systems.

Miniature rugged FPD-Link™ III camera module available now for transportation, industrial vision systems

October 11, 2018

Small and lightweight, the 1.3MP sealed camera module is designed to IP69K and fully validated for production

DesignCore® Jetson SerDes Sensor Interface Card supports NVIDIA Jetson TX1/TX2 and Xavier™ Developer Kits

September 20, 2018

Engineers can easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development

D3 Becomes NVIDIA Jetson Preferred Partner for Camera Development

August 20, 2018

Access to Jetson camera toolchain enhances D3 Engineering’s embedded vision system development capabilities for high-performance, cost-optimized custom camera systems

D3 Engineering announces rugged FPD-Link™ III camera modules for automotive and industrial vision

August 1, 2018

Small, lightweight, sealed camera modules are designed to IP69K

DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design

May 14, 2018

Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.

Development platforms pave the way to production systems for ADAS

January 23, 2018

Developing a production advanced driver assistance system (ADAS) requires working in both controlled laboratory environments and real-world scenarios. Development platforms from TI’s ecosystem design partners can help.

DragonBoard™ 410c Camera Kit available now on Arrow.com

November 14, 2017

D3 camera mezzanine board enables direct MIPI CSI-2 access to Snapdragon® processor for rapid development of high-performance embedded vision applications

D3 to Speak at Image Sensors Auto Americas 2017

September 18, 2017

D3 Engineering’s Jerome Barczykowski will present “System engineering considerations in rugged/automotive camera module design” at Image Sensors Auto Americas, October 10–11 in San Francisco, CA.