New TDA2Px / DRA77xP Dev Kit speeds ADAS, autonomous system design through production

October 29, 2018

D3 Engineering DesignCore® Rugged Vision Platform (RVP) supports on-vehicle technology evaluation, rapid development of A-samples, and a streamlined path to production

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D3 Engineering to show rugged TX2 Development Kit at NVIDIA GPU Technology Conference

October 18, 2018

DesignCore® RSP-TX2 Rugged Sensor Platform connects multiple vision and spatial sensors to the NVIDIA Jetson TX2 for deployment in rugged systems.

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Miniature rugged FPD-Link™ III camera module available now for transportation, industrial vision systems

October 11, 2018

Small and lightweight, the 1.3MP sealed camera module is designed to IP69K and fully validated for production

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DesignCore® Jetson SerDes Sensor Interface Card supports NVIDIA Jetson TX1/TX2 and Xavier™ Developer Kits

September 20, 2018

Engineers can easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development

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D3 Becomes NVIDIA Jetson Preferred Partner for Camera Development

August 20, 2018

Access to Jetson camera toolchain enhances D3 Engineering’s embedded vision system development capabilities for high-performance, cost-optimized custom camera systems

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D3 Engineering announces rugged FPD-Link™ III camera modules for automotive and industrial vision

August 1, 2018

Small, lightweight, sealed camera modules are designed to IP69K

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DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design

May 14, 2018

Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.

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Development platforms pave the way to production systems for ADAS

January 23, 2018

Developing a production advanced driver assistance system (ADAS) requires working in both controlled laboratory environments and real-world scenarios. Development platforms from TI’s ecosystem design partners can help.

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DragonBoard™ 410c Camera Kit available now on

November 14, 2017

D3 camera mezzanine board enables direct MIPI CSI-2 access to Snapdragon® processor for rapid development of high-performance embedded vision applications

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D3 to Speak at Image Sensors Auto Americas 2017

September 18, 2017

D3 Engineering’s Jerome Barczykowski will present “System engineering considerations in rugged/automotive camera module design” at Image Sensors Auto Americas, October 10–11 in San Francisco, CA.

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