DesignCore® Jetson SerDes Sensor Interface Card supports NVIDIA Jetson TX1/TX2 and Xavier™ Developer Kits

September 20, 2018

Engineers can easily interface multiple cameras and other sensors to the Jetson platform for realistic benchtop evaluation and rapid proof-of-concept development

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D3 Becomes NVIDIA Jetson Preferred Partner for Camera Development

August 20, 2018

Access to Jetson camera toolchain enhances D3 Engineering’s embedded vision system development capabilities for high-performance, cost-optimized custom camera systems

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D3 Engineering announces rugged FPD-Link™ III camera modules for automotive and industrial vision

August 1, 2018

Small, lightweight, sealed camera modules are designed to IP69K

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DesignCore™ DMS Kit features FotoNation algorithms, TI automotive processors in production-intent design

May 14, 2018

Ready for on-vehicle or field testing, the development kit supports rapid development of in-cabin DMS (Driver Monitoring System) applications including eye gaze, head position, face recognition, and drowsiness detection.

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Development platforms pave the way to production systems for ADAS

January 23, 2018

Developing a production advanced driver assistance system (ADAS) requires working in both controlled laboratory environments and real-world scenarios. Development platforms from TI’s ecosystem design partners can help.

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DragonBoard™ 410c Camera Kit available now on

November 14, 2017

D3 camera mezzanine board enables direct MIPI CSI-2 access to Snapdragon® processor for rapid development of high-performance embedded vision applications

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D3 to Speak at Image Sensors Auto Americas 2017

September 18, 2017

D3 Engineering’s Jerome Barczykowski will present “System engineering considerations in rugged/automotive camera module design” at Image Sensors Auto Americas, October 10–11 in San Francisco, CA.

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D3 camera board featured on 96Boards OpenHours

June 27, 2017

96Boards OpenHours featured D3 Engineering’s DesignCore Camera Mezzanine board for the DragonBoard 410c. The session included demos from D3 in Rochester, NY and the Qualcomm Thinkabit lab in San Diego. View the recorded session and chat log on

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Tandem motion-power 48 V motor control board by Intel and D3

May 2, 2017

A new article on Power Systems Design describes the new motor control hardware platform designed by Intel and D3 Engineering. This tandem motion-power motor control board features a single Max® 10 FPGA to control a bidirectional DC-DC converter as well as two motors.

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DesignCore™ Camera Mezzanine Board for DragonBoard 410c speeds embedded vision development

April 20, 2017

Direct MIPI CSI-2 access to camera data enables more realistic evaluation of lower power, higher performance embedded vision systems and proof-of-concept prototypes.

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