OEM Smart Camera with Autofocus

D3 Engineering's OEM Smart Camera Board is a compact, powerful and flexible image processing platform. Now incorporating New Scale's M3-F focus module for built-in piezoelectric autofocus, this camera developer's kit is a great starting point for imaging applications that require the very highest image resolution in a compact footprint.

 

Features

  • Autofocus: High-precision piezo lens motion system delivers best image resolution, focus range and flexibility.
     
  • Highest image resolution: Color image sensor up to 14 MP combined with advanced Sunex optics for ultra-sharp images with small pixel size
     
  • Smallest size: The imaging module is 1.25  x 1.25" wide by 0.9" deep (without lens). The compact electronics kit can be configured for any small-form-factor product requirement.
     
  • Complete camera system: Incorporates imager, lens, autofocus system, DSP, SD card, video output (HDMI & NTSC) and Ethernet.
     
  • Fast time to market: OEM-ready camera solution quickly customized to your specifications.
     

Applications

Improve performance of miniature cameras for biometric detection and facial recognition, medical devices and imaging, machine vision, miniature surveillance cameras and security analytics, scanning systems, set top boxes, scientific imaging and a wide range of handheld systems.

 

Complete, high-resolution mini camera system

The imaging module features high-precision autofocus with a New Scale Technologies piezoelectric lens motion module and Sunex high-performance lens system of your choice. The module supports CMOS sensors from all vendors including Aptina, OmniVision and CMOSIS.
 

D3 Engineering's SmartCam electronics incorporate a Texas Instruments DaVinci™ DM6437 DSP, 256 MB DDR2 memory, HDMI & NTSC video output, and 10/100 Ethernet. A flat flex cable connects to the imaging module. Daughtercard connections allow access to all processor peripherals and GPIO. This versatile, full-featured kit enables easy evaluation and system design. D3 configures even smaller electronics to meet your specific OEM product requirements for functionality and small footprint.
 

Precision autofocus: max resolution, flexibility

Autofocus provides increased field of focus for rapid image capture at variable distances. It enables greater variation in the size, shape and position of target objects to be imaged. The result is maximum image resolution with faster, less obtrusive detection systems.

 

New Scale's M3-F focus module delivers superior performance to other focus solutions. It features highest lens position resolution and repeatability, very low tip/tilt, and long lens travel stroke with no hysteresis. It is a robust focus solution with >2M cycles MTBF (fixed orientation).

 

The M3-F can move lenses up to 5 grams, supporting advanced glass and polymer lenses from Sunex, an industry leader in high-performance OEM optics. Sunex lenses feature patented aspheric optical technology, proprietary high-index optical materials and integral optical filters. Sunex has a wide range of off-the-shelf options as well as a complete custom lens capability, from design to mass production.

 

Customizable and OEM ready

Designed for high-volume production, this camera kit features low bill of material costs, EMI testing, DDR2 timing, and RoHS compliance. It can be used as-is or customized for you. Imaging module options include a wide range of image sensors and lenses. Electronics board options include other processors and speeds; a 7" NTSC LCD option, and daughtercards for GPIO and CPLD. D3 Engineering will help you define a solution to meet your specific requirements.
 

 

Download developer's kit data sheet with drawings (165K PDF)

OEM SmartCamera Developer's Kit Specifications
Image Sensor CMOS sensors up to 17x17 mm.  Suggested models below. Contact D3 Engineering for full list of options.
Lens Sunex lenses M7 to M12, up to 5 grams.
Suggested models include DSL853, DSL924, DSL935, and DSL944.
Contact Sunex for full list of options.
Lens motion New Scale Technologies piezoelectric focus module (M3-F)
Processor Texas Instruments 700 Mhz DSP (TMS320DM6437)
Memory (on-chip) 56k L1DC, 56k L1PC, 128k L2C/SRAM
Memory (off-chip) 256 MB DDR2 167 Mhz Clock 333 Mhz Data Rate
Flash (program/data space) 128 MB
GPIO 12 GPIO lines;  PWMs
Serial IO 2 UART/CAN; 2 McBSP (or SPI); I2C
10/100 Ethernet Yes, on-board
Video out HDMI; NTSC (SMA connector)
Dimensions Imaging module: 1.25 W x 1.25" L x 0.87" H (+ lens stack)
Electronics board stack: 1.9 W x 2.5 L x 1.18" H
Cables (included) Flat flex cable 12"
Power / operating voltage 500 mA @ 5 VDC, 5V 1.5mm wallpack included

 

Image Sensors
Model Format Pixel size Active pixels Shutter
Aptina MT9V034 WVGA 6.0 752 x 480 global
Aptina MT9M021 720p 3.75 1280 x 960 global
Aptina MT9P401 5 MP 2.2 2592 x 1944 rolling
OmniVIsion OV2715 1080p 3.0 1920 x 1080 rolling
OmniVision OV5642 5 MP 1.4 2592 x 1944 rolling
OmniVision OV14810 14 MP 1.4 4416 x 3312 rolling
many others available Call D3 Engineering re. support for your choice of image sensor

 

For more information

  • SmartCamera Kit specifications, customization and volume pricing: Call D3 Engineering at (585) 429-1550 or visit www.d3engineering.com
     
  • M3-F focus module details: Call New Scale at (585) 924-4450 or visit www.newscaletech.com/M3-F
     
  • Lens selection: Call Sunex at (760) 597-2966 or visit www.sunex.com

 

How to order

Call D3 Engineering at  (585) 429-1550.
 

 

 

 

 

 

To order

Call D3 Engineering

(585) 429-1550